Technische Details ESQT-136-02-L-T-750 Samtec
Description: CONN SOCKET 108P 0.079 GOLD PCB, Packaging: Tube, Connector Type: Elevated Socket, Current Rating (Amps): 4.5A per Contact, Mounting Type: Through Hole, Number of Positions: 108, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 125°C, Contact Type: Forked, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.079" (2.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Post: Tin, Contact Length - Post: 0.100" (2.54mm), Insulation Height: 0.750" (19.05mm), Row Spacing - Mating: 0.079" (2.00mm), Number of Rows: 3.
Weitere Produktangebote ESQT-136-02-L-T-750
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
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ESQT-136-02-L-T-750 | Hersteller : Samtec Inc. |
Description: CONN SOCKET 108P 0.079 GOLD PCB Packaging: Tube Connector Type: Elevated Socket Current Rating (Amps): 4.5A per Contact Mounting Type: Through Hole Number of Positions: 108 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Forked Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.079" (2.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Contact Length - Post: 0.100" (2.54mm) Insulation Height: 0.750" (19.05mm) Row Spacing - Mating: 0.079" (2.00mm) Number of Rows: 3 |
Produkt ist nicht verfügbar |
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ESQT-136-02-L-T-750 | Hersteller : Samtec |
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Produkt ist nicht verfügbar |