ESQT-110-02-G-D-750 Samtec
auf Bestellung 22 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 11.84 EUR |
| 10+ | 10.95 EUR |
| 25+ | 10.37 EUR |
| 50+ | 9.98 EUR |
| 100+ | 9.68 EUR |
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Technische Details ESQT-110-02-G-D-750 Samtec
Description: CONN SOCKET 20POS 0.079 GOLD PCB, Packaging: Bulk, Connector Type: Elevated Socket, Current Rating (Amps): 4.5A per Contact, Mounting Type: Through Hole, Number of Positions: 20, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 125°C, Contact Type: Forked, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.079" (2.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 20.0µin (0.51µm), Contact Finish - Post: Gold, Contact Length - Post: 0.100" (2.54mm), Insulation Height: 0.750" (19.05mm), Row Spacing - Mating: 0.079" (2.00mm), Number of Rows: 2.
Weitere Produktangebote ESQT-110-02-G-D-750 nach Preis ab 12.83 EUR bis 16.68 EUR
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ESQT-110-02-G-D-750 | Hersteller : Samtec Inc. |
 Description: CONN SOCKET 20POS 0.079 GOLD PCBPackaging: Bulk Connector Type: Elevated Socket Current Rating (Amps): 4.5A per Contact Mounting Type: Through Hole Number of Positions: 20 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Forked Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.079" (2.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 20.0µin (0.51µm) Contact Finish - Post: Gold Contact Length - Post: 0.100" (2.54mm) Insulation Height: 0.750" (19.05mm) Row Spacing - Mating: 0.079" (2.00mm) Number of Rows: 2 |
auf Bestellung 29 Stücke: Lieferzeit 10-14 Tag (e) |
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