ESQT-110-02-F-S-500 Samtec
auf Bestellung 24 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 4.75 EUR |
| 50+ | 3.87 EUR |
| 100+ | 3.29 EUR |
| 500+ | 2.92 EUR |
| 1000+ | 2.87 EUR |
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Technische Details ESQT-110-02-F-S-500 Samtec
Description: CONN SOCKET 10POS 0.079 GOLD PCB, Packaging: Bulk, Connector Type: Elevated Socket, Current Rating (Amps): 4.5A per Contact, Mounting Type: Through Hole, Number of Positions: 10, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 125°C, Contact Type: Forked, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.079" (2.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 3.00µin (0.076µm), Contact Finish - Post: Tin, Part Status: Active, Contact Length - Post: 0.350" (8.89mm), Insulation Height: 0.500" (12.70mm), Number of Rows: 1.
Weitere Produktangebote ESQT-110-02-F-S-500 nach Preis ab 4.93 EUR bis 5.42 EUR
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ESQT-110-02-F-S-500 | Hersteller : Samtec Inc. |
Description: CONN SOCKET 10POS 0.079 GOLD PCB Packaging: Bulk Connector Type: Elevated Socket Current Rating (Amps): 4.5A per Contact Mounting Type: Through Hole Number of Positions: 10 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Forked Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.079" (2.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Part Status: Active Contact Length - Post: 0.350" (8.89mm) Insulation Height: 0.500" (12.70mm) Number of Rows: 1 |
auf Bestellung 61 Stücke: Lieferzeit 10-14 Tag (e) |
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