Technische Details ESQT-108-02-G-D-458 Samtec
Description: CONN SOCKET 16POS 0.079 GOLD PCB, Packaging: Bulk, Connector Type: Elevated Socket, Current Rating (Amps): 4.5A per Contact, Mounting Type: Through Hole, Number of Positions: 16, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 125°C, Contact Type: Forked, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.079" (2.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 20.0µin (0.51µm), Contact Finish - Post: Gold, Contact Length - Post: 0.392" (9.96mm), Insulation Height: 0.458" (11.63mm), Row Spacing - Mating: 0.079" (2.00mm), Number of Rows: 2.
Weitere Produktangebote ESQT-108-02-G-D-458
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
---|---|---|---|---|---|
![]() |
ESQT-108-02-G-D-458 | Hersteller : Samtec |
![]() |
Produkt ist nicht verfügbar |
|
ESQT-108-02-G-D-458 | Hersteller : Samtec Inc. |
Description: CONN SOCKET 16POS 0.079 GOLD PCB Packaging: Bulk Connector Type: Elevated Socket Current Rating (Amps): 4.5A per Contact Mounting Type: Through Hole Number of Positions: 16 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Forked Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.079" (2.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 20.0µin (0.51µm) Contact Finish - Post: Gold Contact Length - Post: 0.392" (9.96mm) Insulation Height: 0.458" (11.63mm) Row Spacing - Mating: 0.079" (2.00mm) Number of Rows: 2 |
Produkt ist nicht verfügbar |
||
![]() |
ESQT-108-02-G-D-458 | Hersteller : Samtec |
![]() |
Produkt ist nicht verfügbar |