![ESQ-115-23-G-D ESQ-115-23-G-D](https://mm.digikey.com/Volume0/opasdata/d220001/medias/images/6024/ESQ-115-23-G-D.jpg)
ESQ-115-23-G-D Samtec Inc.
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Description: CONN SOCKET 30POS 0.1 GOLD PCB
Packaging: Tube
Connector Type: Elevated Socket
Voltage Rating: 550VAC
Current Rating (Amps): 5.7A per Contact
Mounting Type: Through Hole
Number of Positions: 30
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Forked
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 20.0µin (0.51µm)
Contact Finish - Post: Gold
Contact Length - Post: 0.190" (4.83mm)
Insulation Height: 0.535" (13.60mm)
Row Spacing - Mating: 0.100" (2.54mm)
Number of Rows: 2
auf Bestellung 99 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
2+ | 15.17 EUR |
10+ | 13.66 EUR |
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Technische Details ESQ-115-23-G-D Samtec Inc.
Description: CONN SOCKET 30POS 0.1 GOLD PCB, Packaging: Tube, Connector Type: Elevated Socket, Voltage Rating: 550VAC, Current Rating (Amps): 5.7A per Contact, Mounting Type: Through Hole, Number of Positions: 30, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Forked, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 20.0µin (0.51µm), Contact Finish - Post: Gold, Contact Length - Post: 0.190" (4.83mm), Insulation Height: 0.535" (13.60mm), Row Spacing - Mating: 0.100" (2.54mm), Number of Rows: 2.
Weitere Produktangebote ESQ-115-23-G-D
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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ESQ-115-23-G-D | Hersteller : Samtec |
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Produkt ist nicht verfügbar |
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ESQ-115-23-G-D | Hersteller : Samtec |
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Produkt ist nicht verfügbar |