![EHF-110-01-LM-D-SM-LC-P EHF-110-01-LM-D-SM-LC-P](https://media.digikey.com/Renders/Samtec%20Renders/EHF-110-01-x-D-SM-LC.jpg)
EHF-110-01-LM-D-SM-LC-P Samtec Inc.
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Description: CONN HEADER SMD 20POS 1.27MM
Packaging: Tube
Features: Board Lock, Keying Slot, Pick and Place
Connector Type: Header
Current Rating (Amps): 1.75A
Mounting Type: Surface Mount
Number of Positions: 20
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Latch Lock/Eject Hooks
Number of Positions Loaded: All
Termination: Solder
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.325" (8.25mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.050" (1.27mm)
Contact Length - Mating: 0.120" (3.05mm)
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Technische Details EHF-110-01-LM-D-SM-LC-P Samtec Inc.
Description: CONN HEADER SMD 20POS 1.27MM, Packaging: Tube, Features: Board Lock, Keying Slot, Pick and Place, Connector Type: Header, Current Rating (Amps): 1.75A, Mounting Type: Surface Mount, Number of Positions: 20, Number of Rows: 2, Style: Board to Cable/Wire, Operating Temperature: -55°C ~ 125°C, Contact Type: Male Pin, Fastening Type: Latch Lock/Eject Hooks, Number of Positions Loaded: All, Termination: Solder, Contact Material: Phosphor Bronze, Insulation Color: Black, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Insulation Height: 0.325" (8.25mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled, Row Spacing - Mating: 0.050" (1.27mm), Contact Length - Mating: 0.120" (3.05mm).
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EHF-110-01-LM-D-SM-LC-P | Hersteller : Samtec |
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