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EFPLS63J104B112LH Eaton - Electronics Division
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Description: CAP FILM 0.1UF 5% 630VDC RAD
Packaging: Bulk
Tolerance: ±5%
Package / Case: Radial
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 105°C
Applications: High Frequency, Switching; High Pulse, DV/DT
Lead Spacing: 0.591" (15.00mm)
Termination: PC Pins
Dielectric Material: Polypropylene (PP), Metallized
Voltage Rating - DC: 630V
Height - Seated (Max): 0.650" (16.50mm)
Capacitance: 0.1 µF
ESR (Equivalent Series Resistance): 13 mOhms
Size / Dimension: 0.709" L x 0.394" W (18.00mm x 10.00mm)
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Technische Details EFPLS63J104B112LH Eaton - Electronics Division
Description: CAP FILM 0.1UF 5% 630VDC RAD, Packaging: Bulk, Tolerance: ±5%, Package / Case: Radial, Mounting Type: Through Hole, Operating Temperature: -40°C ~ 105°C, Applications: High Frequency, Switching; High Pulse, DV/DT, Lead Spacing: 0.591" (15.00mm), Termination: PC Pins, Dielectric Material: Polypropylene (PP), Metallized, Voltage Rating - DC: 630V, Height - Seated (Max): 0.650" (16.50mm), Capacitance: 0.1 µF, ESR (Equivalent Series Resistance): 13 mOhms, Size / Dimension: 0.709" L x 0.394" W (18.00mm x 10.00mm).
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EFPLS63J104B112LH | Hersteller : Bussmann / Eaton |
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