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DSPIC33EP256GM604-H/ML Microchip Technology
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Description: IC MCU 16BIT 256KB FLASH 44QFN
Packaging: Tube
Package / Case: 44-VQFN Exposed Pad
Mounting Type: Surface Mount
Program Memory Size: 256KB (85.5K x 24)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC
Data Converters: A/D 18x10b/12b
Core Size: 16-Bit
Connectivity: CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 44-QFN (8x8)
Number of I/O: 35
DigiKey Programmable: Not Verified
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Technische Details DSPIC33EP256GM604-H/ML Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 44QFN, Packaging: Tube, Package / Case: 44-VQFN Exposed Pad, Mounting Type: Surface Mount, Program Memory Size: 256KB (85.5K x 24), RAM Size: 32K x 8, Operating Temperature: -40°C ~ 150°C (TA), Oscillator Type: Internal, Program Memory Type: FLASH, Core Processor: dsPIC, Data Converters: A/D 18x10b/12b, Core Size: 16-Bit, Connectivity: CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART, Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT, Supplier Device Package: 44-QFN (8x8), Number of I/O: 35, DigiKey Programmable: Not Verified.
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DSPIC33EP256GM604-H/ML | Hersteller : Microchip Technology |
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