auf Bestellung 4612 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 3+ | 1.2 EUR |
| 10+ | 0.9 EUR |
| 105+ | 0.83 EUR |
| 510+ | 0.82 EUR |
| 1005+ | 0.81 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details DILB32P-223TLF Amphenol FCI
Description: CONN IC DIP SOCKET 32POS TINLEAD, Features: Open Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 32 (2 x 16), Termination: Solder, Housing Material: Polyamide (PA), Nylon, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin-Lead, Contact Finish Thickness - Mating: 100.0µin (2.54µm), Contact Material - Mating: Copper Alloy, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin-Lead, Contact Finish Thickness - Post: 100.0µin (2.54µm), Contact Material - Post: Copper Alloy, Part Status: Active.
Weitere Produktangebote DILB32P-223TLF nach Preis ab 0.75 EUR bis 1.23 EUR
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DILB32P-223TLF | Hersteller : Amphenol ICC (FCI) |
 Description: CONN IC DIP SOCKET 32POS TINLEADFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polyamide (PA), Nylon Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin-Lead Contact Finish Thickness - Mating: 100.0µin (2.54µm) Contact Material - Mating: Copper Alloy Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 100.0µin (2.54µm) Contact Material - Post: Copper Alloy Part Status: Active |
auf Bestellung 7018 Stücke: Lieferzeit 10-14 Tag (e) |
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| DILB32P-223TLF | Hersteller : FCI |
Conn DIP Socket SKT 32 POS 2.54mm Solder ST Thru-Hole Tube |
Produkt ist nicht verfügbar |
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| DILB32P-223TLF | Hersteller : AMPHENOL |
DILB32P223TLF-AMP Unclassified |
Produkt ist nicht verfügbar |