DILB18P-223TLF Amphenol ICC (FCI)
Hersteller: Amphenol ICC (FCI)
Description: CONN IC DIP SOCKET 18POS TINLEAD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA), Nylon
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Material - Mating: Copper Alloy
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 100.0µin (2.54µm)
Contact Material - Post: Copper Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 18POS TINLEAD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA), Nylon
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Material - Mating: Copper Alloy
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 100.0µin (2.54µm)
Contact Material - Post: Copper Alloy
Part Status: Active
auf Bestellung 10747 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
22+ | 0.83 EUR |
25+ | 0.72 EUR |
27+ | 0.65 EUR |
52+ | 0.61 EUR |
104+ | 0.59 EUR |
260+ | 0.54 EUR |
520+ | 0.51 EUR |
1014+ | 0.45 EUR |
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Produktbewertung abgeben
Technische Details DILB18P-223TLF Amphenol ICC (FCI)
Description: CONN IC DIP SOCKET 18POS TINLEAD, Features: Open Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 18 (2 x 9), Termination: Solder, Housing Material: Polyamide (PA), Nylon, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin-Lead, Contact Finish Thickness - Mating: 100.0µin (2.54µm), Contact Material - Mating: Copper Alloy, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin-Lead, Contact Finish Thickness - Post: 100.0µin (2.54µm), Contact Material - Post: Copper Alloy, Part Status: Active.
Weitere Produktangebote DILB18P-223TLF nach Preis ab 0.49 EUR bis 1.02 EUR
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt | ||||||||||||||||
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DILB18P-223TLF | Hersteller : Amphenol FCI | IC & Component Sockets SOCKETS DIP |
auf Bestellung 7631 Stücke: Lieferzeit 10-14 Tag (e) |
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DILB18P223TLF | Hersteller : AMPHENOL COMMUNICATIONS SOLUTIONS |
Description: AMPHENOL COMMUNICATIONS SOLUTIONS - DILB18P223TLF - IC- & Baustein-Sockel, 18 Kontakt(e), DIP-Sockel, 2.54 mm, 7.62 mm, Kupferlegierung tariffCode: 85366930 productTraceability: No Kontaktüberzug: Verzinnte Kontakte Steckverbindertyp: DIP-Sockel rohsCompliant: YES Rastermaß: 2.54mm Anzahl der Kontakte: 18Contacts euEccn: NLR Kontaktmaterial: Kupferlegierung hazardous: false Reihenabstand: 7.62mm rohsPhthalatesCompliant: YES usEccn: EAR99 Produktpalette: - SVHC: No SVHC (17-Dec-2015) |
auf Bestellung 4 Stücke: Lieferzeit 14-21 Tag (e) |
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DILB18P223TLF | Hersteller : FCI | Conn DIP Socket SKT 18 POS 2.54mm Solder ST Thru-Hole Tube |
Produkt ist nicht verfügbar |
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DILB18P-223TLF | Hersteller : AMPHENOL | DILB18P223TLF-AMP Unclassified |
Produkt ist nicht verfügbar |