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DF9-23S-1V(32) Hirose Connector
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Board to Board & Mezzanine Connectors 1.0MM V SMT RECPT 23P TIN PLATING
auf Bestellung 1477 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
2+ | 2.45 EUR |
10+ | 2.22 EUR |
100+ | 1.99 EUR |
500+ | 1.65 EUR |
1000+ | 1.37 EUR |
5000+ | 1.25 EUR |
10000+ | 1.22 EUR |
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Technische Details DF9-23S-1V(32) Hirose Connector
Description: CONN RCPT 23POS SMD TIN, Packaging: Tape & Reel (TR), Features: Board Guide, Solder Retention, Connector Type: Receptacle, Outer Shroud Contacts, Contact Finish: Tin, Mounting Type: Surface Mount, Number of Positions: 23, Pitch: 0.039" (1.00mm), Height Above Board: 0.130" (3.30mm), Contact Finish Thickness: 39.4µin (1.00µm), Mated Stacking Heights: 4.3mm, Number of Rows: 2.
Weitere Produktangebote DF9-23S-1V(32)
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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DF9-23S-1V(32) | Hersteller : Hirose Electric Co Ltd |
![]() Packaging: Tape & Reel (TR) Features: Board Guide, Solder Retention Connector Type: Receptacle, Outer Shroud Contacts Contact Finish: Tin Mounting Type: Surface Mount Number of Positions: 23 Pitch: 0.039" (1.00mm) Height Above Board: 0.130" (3.30mm) Contact Finish Thickness: 39.4µin (1.00µm) Mated Stacking Heights: 4.3mm Number of Rows: 2 |
Produkt ist nicht verfügbar |
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DF9-23S-1V(32) | Hersteller : Hirose Electric Co Ltd |
![]() Packaging: Cut Tape (CT) Features: Board Guide, Solder Retention Connector Type: Receptacle, Outer Shroud Contacts Contact Finish: Tin Mounting Type: Surface Mount Number of Positions: 23 Pitch: 0.039" (1.00mm) Height Above Board: 0.130" (3.30mm) Contact Finish Thickness: 39.4µin (1.00µm) Mated Stacking Heights: 4.3mm Number of Rows: 2 |
Produkt ist nicht verfügbar |