DF9-13S-1V(32) Hirose Electric Co Ltd
Hersteller: Hirose Electric Co Ltd
Description: CONN RCPT 13POS SMD TIN
Packaging: Tape & Reel (TR)
Features: Board Guide, Solder Retention
Connector Type: Receptacle, Outer Shroud Contacts
Contact Finish: Tin
Mounting Type: Surface Mount
Number of Positions: 13
Pitch: 0.039" (1.00mm)
Height Above Board: 0.130" (3.30mm)
Contact Finish Thickness: 39.4µin (1.00µm)
Mated Stacking Heights: 4.3mm
Part Status: Active
Number of Rows: 2
Description: CONN RCPT 13POS SMD TIN
Packaging: Tape & Reel (TR)
Features: Board Guide, Solder Retention
Connector Type: Receptacle, Outer Shroud Contacts
Contact Finish: Tin
Mounting Type: Surface Mount
Number of Positions: 13
Pitch: 0.039" (1.00mm)
Height Above Board: 0.130" (3.30mm)
Contact Finish Thickness: 39.4µin (1.00µm)
Mated Stacking Heights: 4.3mm
Part Status: Active
Number of Rows: 2
auf Bestellung 13000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
1000+ | 0.96 EUR |
2000+ | 0.9 EUR |
3000+ | 0.87 EUR |
5000+ | 0.84 EUR |
10000+ | 0.8 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details DF9-13S-1V(32) Hirose Electric Co Ltd
Description: CONN RCPT 13POS SMD TIN, Packaging: Tape & Reel (TR), Features: Board Guide, Solder Retention, Connector Type: Receptacle, Outer Shroud Contacts, Contact Finish: Tin, Mounting Type: Surface Mount, Number of Positions: 13, Pitch: 0.039" (1.00mm), Height Above Board: 0.130" (3.30mm), Contact Finish Thickness: 39.4µin (1.00µm), Mated Stacking Heights: 4.3mm, Part Status: Active, Number of Rows: 2.
Weitere Produktangebote DF9-13S-1V(32) nach Preis ab 0.62 EUR bis 1.87 EUR
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt | ||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
DF9-13S-1V(32) | Hersteller : Hirose Electric Co Ltd |
Description: CONN RCPT 13POS SMD TIN Packaging: Cut Tape (CT) Features: Board Guide, Solder Retention Connector Type: Receptacle, Outer Shroud Contacts Contact Finish: Tin Mounting Type: Surface Mount Number of Positions: 13 Pitch: 0.039" (1.00mm) Height Above Board: 0.130" (3.30mm) Contact Finish Thickness: 39.4µin (1.00µm) Mated Stacking Heights: 4.3mm Part Status: Active Number of Rows: 2 |
auf Bestellung 13308 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||
DF9-13S-1V(32) | Hersteller : Hirose Connector | Board to Board & Mezzanine Connectors 1.0MM V SMT RECPT 13P TIN PLATING |
auf Bestellung 6262 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||
DF9-13S-1V(32) | Hersteller : Hirose | Conn Board to Board RCP 13 POS 1mm Solder ST SMD T/R |
auf Bestellung 3000 Stücke: Lieferzeit 14-21 Tag (e) |
|