DF12(3.0)-30DS-0.5V(86) Hirose Connector
Hersteller: Hirose Connector
Board to Board & Mezzanine Connectors 30P V SMT DR RECPT 3.0MM STK HT GOLD
Board to Board & Mezzanine Connectors 30P V SMT DR RECPT 3.0MM STK HT GOLD
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Lieferzeit 10-14 Tag (e)
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Technische Details DF12(3.0)-30DS-0.5V(86) Hirose Connector
Description: CONN RCPT 30POS SMD GOLD, Packaging: Tape & Reel (TR), Features: Board Guide, Solder Retention, Connector Type: Receptacle, Center Strip Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 30, Pitch: 0.020" (0.50mm), Height Above Board: 0.087" (2.20mm), Contact Finish Thickness: 8.00µin (0.203µm), Mated Stacking Heights: 3mm, Part Status: Obsolete, Number of Rows: 2.
Weitere Produktangebote DF12(3.0)-30DS-0.5V(86)
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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DF12(3.0)-30DS-0.5V(86) | Hersteller : Hirose Electric Co Ltd |
Description: CONN RCPT 30POS SMD GOLD Packaging: Tape & Reel (TR) Features: Board Guide, Solder Retention Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 30 Pitch: 0.020" (0.50mm) Height Above Board: 0.087" (2.20mm) Contact Finish Thickness: 8.00µin (0.203µm) Mated Stacking Heights: 3mm Part Status: Obsolete Number of Rows: 2 |
Produkt ist nicht verfügbar |
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DF12(3.0)-30DS-0.5V(86) | Hersteller : Hirose Electric Co Ltd |
Description: CONN RCPT 30POS SMD GOLD Packaging: Cut Tape (CT) Features: Board Guide, Solder Retention Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 30 Pitch: 0.020" (0.50mm) Height Above Board: 0.087" (2.20mm) Contact Finish Thickness: 8.00µin (0.203µm) Mated Stacking Heights: 3mm Part Status: Obsolete Number of Rows: 2 |
Produkt ist nicht verfügbar |