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DF12(3.0)-10DP-0.5V(86) Hirose Connector
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Board to Board & Mezzanine Connectors 10P V SMT DR HDR 3.0MM STK HT GOLD
auf Bestellung 3060 Stücke:
Lieferzeit 10-14 Tag (e)
Produktrezensionen
Produktbewertung abgeben
Technische Details DF12(3.0)-10DP-0.5V(86) Hirose Connector
Description: CONN HDR 10POS SMD GOLD, Packaging: Tape & Reel (TR), Features: Board Guide, Solder Retention, Connector Type: Header, Outer Shroud Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 10, Pitch: 0.020" (0.50mm), Height Above Board: 0.091" (2.30mm), Contact Finish Thickness: 8.00µin (0.203µm), Mated Stacking Heights: 3mm, Number of Rows: 2.
Weitere Produktangebote DF12(3.0)-10DP-0.5V(86)
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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DF12(3.0)-10DP-0.5V(86) | Hersteller : HRS |
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auf Bestellung 1000 Stücke: Lieferzeit 21-28 Tag (e) |
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DF12(3.0)-10DP-0.5V(86) | Hersteller : Hirose Electric Co Ltd |
![]() Packaging: Tape & Reel (TR) Features: Board Guide, Solder Retention Connector Type: Header, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 10 Pitch: 0.020" (0.50mm) Height Above Board: 0.091" (2.30mm) Contact Finish Thickness: 8.00µin (0.203µm) Mated Stacking Heights: 3mm Number of Rows: 2 |
Produkt ist nicht verfügbar |
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DF12(3.0)-10DP-0.5V(86) | Hersteller : Hirose Electric Co Ltd |
![]() Packaging: Cut Tape (CT) Features: Board Guide, Solder Retention Connector Type: Header, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 10 Pitch: 0.020" (0.50mm) Height Above Board: 0.091" (2.30mm) Contact Finish Thickness: 8.00µin (0.203µm) Mated Stacking Heights: 3mm Number of Rows: 2 |
Produkt ist nicht verfügbar |