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CYT3DLABHBQ1AESGST Infineon Technologies


Hersteller: Infineon Technologies
CYT3DLABHBQ1AESGST
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Technische Details CYT3DLABHBQ1AESGST Infineon Technologies

Description: TRAVEO-2 CLUST.2.5DGRAPH, Packaging: Tray, Package / Case: 216-LQFP Exposed Pad, Mounting Type: Surface Mount, Speed: 100MHz, 240MHz, Program Memory Size: 4.06MB (4.06M x 8), RAM Size: 384K x 8, Operating Temperature: -40°C ~ 105°C (TA), Oscillator Type: External, Internal, Program Memory Type: FLASH, EEPROM Size: 128K x 8, Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F, Data Converters: A/D 48x12b SAR, Core Size: 32-Bit Dual-Core, Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V, Connectivity: CANbus, Ethernet, I2C, LINbus, SPI, UART/USART, Peripherals: DMA, I2S, LVD, Temp Sensor, WDT, Supplier Device Package: 216-TEQFP (24x24), Number of I/O: 108.

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CYT3DLABHBQ1AESGST Hersteller : Infineon Technologies Description: TRAVEO-2 CLUST.2.5DGRAPH
Packaging: Tray
Package / Case: 216-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 100MHz, 240MHz
Program Memory Size: 4.06MB (4.06M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F
Data Converters: A/D 48x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, Temp Sensor, WDT
Supplier Device Package: 216-TEQFP (24x24)
Number of I/O: 108
Produkt ist nicht verfügbar
CYT3DLABHBQ1AESGST Hersteller : Infineon Technologies Y
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