CYT3DLABGBQ1AESGS Infineon Technologies
Hersteller: Infineon Technologies
Description: IC MCU 32BT 4.063MB FLSH 216TQFP
Packaging: Tray
Package / Case: 216-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.063MB (4.063M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: DMA, I2S, LVD, Temp Sensor, WDT
Peripherals: DMA, I2S, LVD, Temp Sensor, WDT
Supplier Device Package: 216-TEQFP (24x24)
Number of I/O: 108
DigiKey Programmable: Not Verified
Description: IC MCU 32BT 4.063MB FLSH 216TQFP
Packaging: Tray
Package / Case: 216-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.063MB (4.063M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: DMA, I2S, LVD, Temp Sensor, WDT
Peripherals: DMA, I2S, LVD, Temp Sensor, WDT
Supplier Device Package: 216-TEQFP (24x24)
Number of I/O: 108
DigiKey Programmable: Not Verified
auf Bestellung 400 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
1+ | 59.05 EUR |
10+ | 48.00 EUR |
40+ | 44.08 EUR |
80+ | 42.62 EUR |
240+ | 40.82 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details CYT3DLABGBQ1AESGS Infineon Technologies
Description: IC MCU 32BT 4.063MB FLSH 216TQFP, Packaging: Tray, Package / Case: 216-LQFP Exposed Pad, Mounting Type: Surface Mount, Speed: 240MHz, Program Memory Size: 4.063MB (4.063M x 8), RAM Size: 384K x 8, Operating Temperature: -40°C ~ 105°C (TA), Program Memory Type: FLASH, EEPROM Size: 128K x 8, Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F, Core Size: 32-Bit Dual-Core, Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V, Connectivity: DMA, I2S, LVD, Temp Sensor, WDT, Peripherals: DMA, I2S, LVD, Temp Sensor, WDT, Supplier Device Package: 216-TEQFP (24x24), Number of I/O: 108, DigiKey Programmable: Not Verified.
Weitere Produktangebote CYT3DLABGBQ1AESGS
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
---|---|---|---|---|---|
CYT3DLABGBQ1AESGS | Hersteller : Infineon Technologies | ARM Microcontrollers - MCU TRAVEO-2 CLUST.2.5DGRAPH |
Produkt ist nicht verfügbar |