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BU8874F-E2 Rohm Semiconductor
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Description: IC TELECOM INTERFACE 18SOP
Packaging: Tape & Reel (TR)
Package / Case: 18-SOIC (0.213", 5.40mm Width)
Mounting Type: Surface Mount
Function: Receiver, DTMF
Operating Temperature: -10°C ~ 70°C
Voltage - Supply: 4.75V ~ 5.25V
Current - Supply: 2.2mA
Supplier Device Package: 18-SOP
Part Status: Obsolete
Number of Circuits: 1
Power (Watts): 550 mW
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Technische Details BU8874F-E2 Rohm Semiconductor
Description: IC TELECOM INTERFACE 18SOP, Packaging: Tape & Reel (TR), Package / Case: 18-SOIC (0.213", 5.40mm Width), Mounting Type: Surface Mount, Function: Receiver, DTMF, Operating Temperature: -10°C ~ 70°C, Voltage - Supply: 4.75V ~ 5.25V, Current - Supply: 2.2mA, Supplier Device Package: 18-SOP, Part Status: Obsolete, Number of Circuits: 1, Power (Watts): 550 mW.
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Foto | Bezeichnung | Hersteller | Beschreibung |
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BU8874F-E2 | Hersteller : ROHM Semiconductor |
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