BSW-103-04-G-S Samtec
auf Bestellung 311 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 2.59 EUR |
| 10+ | 2.24 EUR |
| 100+ | 2.01 EUR |
| 500+ | 1.67 EUR |
| 1000+ | 1.44 EUR |
| 2500+ | 1.41 EUR |
| 5000+ | 1.4 EUR |
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Technische Details BSW-103-04-G-S Samtec
Description: CONN RCPT 3POS 0.1 GOLD PCB, Packaging: Bulk, Connector Type: Receptacle, Breakaway, Mounting Type: Through Hole, Bottom Mount, Number of Positions: 3, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 20.0µin (0.51µm), Contact Finish - Post: Tin, Contact Length - Post: 0.170" (4.32mm), Insulation Height: 0.350" (8.89mm), Number of Rows: 1.
Weitere Produktangebote BSW-103-04-G-S nach Preis ab 2.27 EUR bis 2.92 EUR
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BSW-103-04-G-S | Hersteller : Samtec Inc. |
 Description: CONN RCPT 3POS 0.1 GOLD PCBPackaging: Bulk Connector Type: Receptacle, Breakaway Mounting Type: Through Hole, Bottom Mount Number of Positions: 3 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 20.0µin (0.51µm) Contact Finish - Post: Tin Contact Length - Post: 0.170" (4.32mm) Insulation Height: 0.350" (8.89mm) Number of Rows: 1 |
auf Bestellung 209 Stücke: Lieferzeit 10-14 Tag (e) |
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