Produkte > HIROSE ELECTRIC CO LTD > BM57B0.6-10DS/2-0.3V(53)
BM57B0.6-10DS/2-0.3V(53)

BM57B0.6-10DS/2-0.3V(53) Hirose Electric Co Ltd


?distributor=digikey&type=catalogue&lang=en&series=BM57 Hersteller: Hirose Electric Co Ltd
Description: CONN RCPT 0.3MM SMD 10POS + 2PWR
Features: Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Receptacle, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 10
Pitch: 0.012" (0.30mm)
Height Above Board: 0.021" (0.55mm)
Contact Finish Thickness: 1.97µin (0.050µm)
Mated Stacking Heights: 0.6mm
Number of Rows: 2
auf Bestellung 857 Stücke:

Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
10+1.95 EUR
11+ 1.65 EUR
25+ 1.58 EUR
50+ 1.54 EUR
100+ 1.48 EUR
250+ 1.34 EUR
500+ 1.21 EUR
Mindestbestellmenge: 10
Produktrezensionen
Produktbewertung abgeben

Technische Details BM57B0.6-10DS/2-0.3V(53) Hirose Electric Co Ltd

Description: CONN RCPT 0.3MM SMD 10POS + 2PWR, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Receptacle, Center Strip Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 10, Pitch: 0.012" (0.30mm), Height Above Board: 0.021" (0.55mm), Contact Finish Thickness: 1.97µin (0.050µm), Mated Stacking Heights: 0.6mm, Number of Rows: 2.

Weitere Produktangebote BM57B0.6-10DS/2-0.3V(53)

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit
Preis ohne MwSt
BM57B0.6-10DS/2-0.3V(53) Hersteller : HIROSE ?distributor=digikey&type=catalogue&lang=en&series=BM57 Category: Other Hirose Connectors
Description: BM57B0.6-10DS/2-0.3V(53)
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
BM57B0.6-10DS/2-0.3V(53) BM57B0.6-10DS/2-0.3V(53) Hersteller : Hirose Electric Co Ltd ?distributor=digikey&type=catalogue&lang=en&series=BM57 Description: CONN RCPT 0.3MM SMD 10POS + 2PWR
Features: Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Receptacle, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 10
Pitch: 0.012" (0.30mm)
Height Above Board: 0.021" (0.55mm)
Contact Finish Thickness: 1.97µin (0.050µm)
Mated Stacking Heights: 0.6mm
Number of Rows: 2
Produkt ist nicht verfügbar
BM57B0.6-10DS/2-0.3V(53) BM57B0.6-10DS/2-0.3V(53) Hersteller : Hirose Connector BM57B0_6_10DS_252F2_0_3V_252853_2529_CL0673_0069_0-3009840.pdf Board to Board & Mezzanine Connectors Rcpt .3mm.6mm Height 1.9mm WidthLow-Profile Hybrid
Produkt ist nicht verfügbar
BM57B0.6-10DS/2-0.3V(53) Hersteller : HIROSE ?distributor=digikey&type=catalogue&lang=en&series=BM57 Category: Other Hirose Connectors
Description: BM57B0.6-10DS/2-0.3V(53)
Produkt ist nicht verfügbar