BM54F3.0-30DP-0.4V(51) Hirose Connector
Hersteller: Hirose ConnectorBoard to Board & Mezzanine Connectors Plug, 0.4mm pitch, 30pos., SMT, 0.3A
auf Bestellung 3000 Stücke:
Lieferzeit 94-98 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 2.9 EUR |
| 10+ | 2.53 EUR |
| 100+ | 2.25 EUR |
| 500+ | 1.88 EUR |
| 1000+ | 1.69 EUR |
| 3000+ | 1.5 EUR |
| 6000+ | 1.43 EUR |
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Technische Details BM54F3.0-30DP-0.4V(51) Hirose Connector
Description: Interconnect Rectangular, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Plug, Outer Shroud Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 30, Pitch: 0.016" (0.40mm), Height Above Board: 0.104" (2.65mm), Mated Stacking Heights: 3mm, Number of Rows: 2.
Weitere Produktangebote BM54F3.0-30DP-0.4V(51)
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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BM54F3.0-30DP-0.4V(51) | Hersteller : Hirose Electric Co Ltd |
Description: Interconnect Rectangular Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Plug, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 30 Pitch: 0.016" (0.40mm) Height Above Board: 0.104" (2.65mm) Mated Stacking Heights: 3mm Number of Rows: 2 |
Produkt ist nicht verfügbar |
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BM54F3.0-30DP-0.4V(51) | Hersteller : Hirose Electric Co Ltd |
Description: Interconnect Rectangular Features: Solder Retention Packaging: Cut Tape (CT) Connector Type: Plug, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 30 Pitch: 0.016" (0.40mm) Height Above Board: 0.104" (2.65mm) Mated Stacking Heights: 3mm Number of Rows: 2 |
Produkt ist nicht verfügbar |