BM54B3.0-30DS-0.4V(51) Hirose Connector
Hersteller: Hirose ConnectorBoard to Board & Mezzanine Connectors Receptacle, 0.4mm pitch, 30pos., SMT, 0.3A
auf Bestellung 4000 Stücke:
Lieferzeit 94-98 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 2.9 EUR |
| 10+ | 2.53 EUR |
| 100+ | 2.25 EUR |
| 500+ | 1.88 EUR |
| 1000+ | 1.61 EUR |
| 2000+ | 1.6 EUR |
| 4000+ | 1.51 EUR |
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Technische Details BM54B3.0-30DS-0.4V(51) Hirose Connector
Description: Interconnect Rectangular, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Receptacle, Center Strip Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 30, Pitch: 0.016" (0.40mm), Height Above Board: 0.067" (1.70mm), Mated Stacking Heights: 3mm, Number of Rows: 2.
Weitere Produktangebote BM54B3.0-30DS-0.4V(51)
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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BM54B3.0-30DS-0.4V(51) | Hersteller : Hirose Electric Co Ltd |
Description: Interconnect Rectangular Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 30 Pitch: 0.016" (0.40mm) Height Above Board: 0.067" (1.70mm) Mated Stacking Heights: 3mm Number of Rows: 2 |
Produkt ist nicht verfügbar |
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BM54B3.0-30DS-0.4V(51) | Hersteller : Hirose Electric Co Ltd |
Description: Interconnect Rectangular Features: Solder Retention Packaging: Cut Tape (CT) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 30 Pitch: 0.016" (0.40mm) Height Above Board: 0.067" (1.70mm) Mated Stacking Heights: 3mm Number of Rows: 2 |
Produkt ist nicht verfügbar |