BM23PF0.8-30DP-0.35V(51) Hirose Electric Co Ltd
Hersteller: Hirose Electric Co LtdDescription: CONN HDR 30POS SMD GOLD
Packaging: Cut Tape (CT)
Features: Solder Retention
Connector Type: Header, Outer Shroud Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 30
Pitch: 0.014" (0.35mm)
Height Above Board: 0.025" (0.63mm)
Contact Finish Thickness: 1.97µin (0.050µm)
Mated Stacking Heights: 0.8mm
Number of Rows: 2
auf Bestellung 9790 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 10+ | 1.76 EUR |
| 12+ | 1.49 EUR |
| 25+ | 1.43 EUR |
| 50+ | 1.40 EUR |
| 100+ | 1.34 EUR |
| 250+ | 1.21 EUR |
| 500+ | 1.09 EUR |
| 1000+ | 0.97 EUR |
| 2500+ | 0.88 EUR |
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Technische Details BM23PF0.8-30DP-0.35V(51) Hirose Electric Co Ltd
Description: CONN HDR 30POS SMD GOLD, Packaging: Tape & Reel (TR), Features: Solder Retention, Connector Type: Header, Outer Shroud Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 30, Pitch: 0.014" (0.35mm), Height Above Board: 0.025" (0.63mm), Contact Finish Thickness: 1.97µin (0.050µm), Mated Stacking Heights: 0.8mm, Number of Rows: 2.
Weitere Produktangebote BM23PF0.8-30DP-0.35V(51)
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
| BM23PF0.8-30DP-0.35V(51) | Hersteller : Hirose Electric Co Ltd |
Description: CONN HDR 30POS SMD GOLD Packaging: Tape & Reel (TR) Features: Solder Retention Connector Type: Header, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 30 Pitch: 0.014" (0.35mm) Height Above Board: 0.025" (0.63mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 |
Produkt ist nicht verfügbar |
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BM23PF0.8-30DP-0.35V(51) | Hersteller : Hirose Connector |
Board to Board & Mezzanine Connectors 30P HDR STRGHT SMT HYBRID W/POWER |
Produkt ist nicht verfügbar |