![BM23PF0.8-10DS-0.35V(895) BM23PF0.8-10DS-0.35V(895)](https://www.mouser.com/images/hiroseelectric/lrg/BM23xx_series_SPl.jpg)
BM23PF0.8-10DS-0.35V(895) Hirose Connector
![BM23PF_Catalog_D165617_en-2585890.pdf](/images/adobe-acrobat.png)
Board to Board & Mezzanine Connectors 10P RCPT STRGHT SMT HYBRID W/POWER
auf Bestellung 7323 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
4+ | 0.81 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details BM23PF0.8-10DS-0.35V(895) Hirose Connector
Description: CONN RCPT 10POS SMD GOLD, Packaging: Tape & Reel (TR), Features: Solder Retention, Connector Type: Receptacle, Center Strip Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 10, Pitch: 0.014" (0.35mm), Height Above Board: 0.031" (0.80mm), Contact Finish Thickness: 1.97µin (0.050µm), Mated Stacking Heights: 0.8mm, Part Status: Active, Number of Rows: 2.
Weitere Produktangebote BM23PF0.8-10DS-0.35V(895) nach Preis ab 0.94 EUR bis 1.8 EUR
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BM23PF0.8-10DS-0.35V(895) | Hersteller : Hirose Electric Co Ltd |
![]() Packaging: Tape & Reel (TR) Features: Solder Retention Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 10 Pitch: 0.014" (0.35mm) Height Above Board: 0.031" (0.80mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Part Status: Active Number of Rows: 2 |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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BM23PF0.8-10DS-0.35V(895) | Hersteller : Hirose Electric Co Ltd |
![]() Packaging: Cut Tape (CT) Features: Solder Retention Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 10 Pitch: 0.014" (0.35mm) Height Above Board: 0.031" (0.80mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Part Status: Active Number of Rows: 2 |
auf Bestellung 3247 Stücke: Lieferzeit 10-14 Tag (e) |
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