BM14C(0.8)-28DP-0.4V(51) Hirose Electric Co Ltd
Hersteller: Hirose Electric Co Ltd
Description: CONN HDR 28POS SMD GOLD
Features: Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Header, Outer Shroud Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 28
Pitch: 0.016" (0.40mm)
Height Above Board: 0.024" (0.61mm)
Contact Finish Thickness: 2.00µin (0.051µm)
Mated Stacking Heights: 0.8mm
Number of Rows: 2
Description: CONN HDR 28POS SMD GOLD
Features: Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Header, Outer Shroud Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 28
Pitch: 0.016" (0.40mm)
Height Above Board: 0.024" (0.61mm)
Contact Finish Thickness: 2.00µin (0.051µm)
Mated Stacking Heights: 0.8mm
Number of Rows: 2
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Technische Details BM14C(0.8)-28DP-0.4V(51) Hirose Electric Co Ltd
Description: CONN HDR 28POS SMD GOLD, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Header, Outer Shroud Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 28, Pitch: 0.016" (0.40mm), Height Above Board: 0.024" (0.61mm), Contact Finish Thickness: 2.00µin (0.051µm), Mated Stacking Heights: 0.8mm, Number of Rows: 2.
Weitere Produktangebote BM14C(0.8)-28DP-0.4V(51)
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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BM14C(0.8)-28DP-0.4V(51) | Hersteller : Hirose Connector | Board to Board & Mezzanine Connectors |
Produkt ist nicht verfügbar |