![BM10B(0.6)-10DP-0.4V(51) BM10B(0.6)-10DP-0.4V(51)](https://eu.mouser.com/images/hiroseelectric/lrg/BM10_Series_Header.jpg)
BM10B(0.6)-10DP-0.4V(51) Hirose Connector
![BM10_catalog-938925.pdf](/images/adobe-acrobat.png)
Board to Board & Mezzanine Connectors 0.4MM FPC TO BOARD 10P HDR 0.6 HGHT
auf Bestellung 4047 Stücke:
Lieferzeit 10-14 Tag (e)
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Technische Details BM10B(0.6)-10DP-0.4V(51) Hirose Connector
Description: CONN HDR 10POS SMD GOLD, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Header, Outer Shroud Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 10, Pitch: 0.016" (0.40mm), Height Above Board: 0.020" (0.50mm), Contact Finish Thickness: 2.00µin (0.051µm), Mated Stacking Heights: 0.6mm, Number of Rows: 2.
Weitere Produktangebote BM10B(0.6)-10DP-0.4V(51)
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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BM10B(0.6)-10DP-0.4V(51) | Hersteller : Hirose Electric Co Ltd |
![]() Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Header, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 10 Pitch: 0.016" (0.40mm) Height Above Board: 0.020" (0.50mm) Contact Finish Thickness: 2.00µin (0.051µm) Mated Stacking Heights: 0.6mm Number of Rows: 2 |
Produkt ist nicht verfügbar |
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BM10B(0.6)-10DP-0.4V(51) | Hersteller : Hirose Electric Co Ltd |
![]() Features: Solder Retention Packaging: Cut Tape (CT) Connector Type: Header, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 10 Pitch: 0.016" (0.40mm) Height Above Board: 0.020" (0.50mm) Contact Finish Thickness: 2.00µin (0.051µm) Mated Stacking Heights: 0.6mm Number of Rows: 2 |
Produkt ist nicht verfügbar |