B32922H3334M EPCOS / TDK
auf Bestellung 1436 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
2+ | 1.65 EUR |
10+ | 1.05 EUR |
100+ | 0.89 EUR |
500+ | 0.69 EUR |
1000+ | 0.59 EUR |
2500+ | 0.55 EUR |
10000+ | 0.53 EUR |
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Technische Details B32922H3334M EPCOS / TDK
Description: CAP FILM 0.33UF 20% 630VDC RAD, Tolerance: ±20%, Features: 85C/85% Humidity, Packaging: Bulk, Package / Case: Radial, Mounting Type: Through Hole, Operating Temperature: -40°C ~ 110°C, Applications: Automotive; EMI, RFI Suppression, Lead Spacing: 0.591" (15.00mm), Termination: PC Pins, Ratings: AEC-Q200, X2, Dielectric Material: Polypropylene (PP), Metallized, Voltage Rating - AC: 305V, Voltage Rating - DC: 630V, Height - Seated (Max): 0.689" (17.50mm), Part Status: Active, Capacitance: 0.33 µF, Size / Dimension: 0.709" L x 0.354" W (18.00mm x 9.00mm).
Weitere Produktangebote B32922H3334M nach Preis ab 0.77 EUR bis 1.83 EUR
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B32922H3334M | Hersteller : EPCOS - TDK Electronics |
Description: CAP FILM 0.33UF 20% 630VDC RAD Tolerance: ±20% Features: 85C/85% Humidity Packaging: Bulk Package / Case: Radial Mounting Type: Through Hole Operating Temperature: -40°C ~ 110°C Applications: Automotive; EMI, RFI Suppression Lead Spacing: 0.591" (15.00mm) Termination: PC Pins Ratings: AEC-Q200, X2 Dielectric Material: Polypropylene (PP), Metallized Voltage Rating - AC: 305V Voltage Rating - DC: 630V Height - Seated (Max): 0.689" (17.50mm) Part Status: Active Capacitance: 0.33 µF Size / Dimension: 0.709" L x 0.354" W (18.00mm x 9.00mm) |
auf Bestellung 928 Stücke: Lieferzeit 10-14 Tag (e) |
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