![B32674Z6155K000 B32674Z6155K000](https://download.siliconexpert.com/pdfs2/2019/12/22/15/22/39/606844/tdk_/manual/b32674d6105k189.jpg)
B32674Z6155K000 TDK ELECTRONICS
Produkt ist nicht verfügbar
Produktrezensionen
Produktbewertung abgeben
Technische Details B32674Z6155K000 TDK ELECTRONICS
Description: CAP FILM 1.5UF 10% 630VDC RADIAL, Packaging: Bulk, Tolerance: ±10%, Package / Case: Radial, Mounting Type: Through Hole, Operating Temperature: -55°C ~ 125°C, Applications: Automotive; Power Factor Correction (PFC), Lead Spacing: 1.083" (27.50mm), Termination: PC Pins, Ratings: AEC-Q200, Dielectric Material: Polypropylene (PP), Metallized, Voltage Rating - AC: 310V, Voltage Rating - DC: 630V, Height - Seated (Max): 0.906" (23.00mm), Capacitance: 1.5 µF, Size / Dimension: 1.240" L x 0.531" W (31.50mm x 13.50mm).
Weitere Produktangebote B32674Z6155K000
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
---|---|---|---|---|---|
![]() |
B32674Z6155K000 | Hersteller : EPCOS - TDK Electronics |
![]() Packaging: Bulk Tolerance: ±10% Package / Case: Radial Mounting Type: Through Hole Operating Temperature: -55°C ~ 125°C Applications: Automotive; Power Factor Correction (PFC) Lead Spacing: 1.083" (27.50mm) Termination: PC Pins Ratings: AEC-Q200 Dielectric Material: Polypropylene (PP), Metallized Voltage Rating - AC: 310V Voltage Rating - DC: 630V Height - Seated (Max): 0.906" (23.00mm) Capacitance: 1.5 µF Size / Dimension: 1.240" L x 0.531" W (31.50mm x 13.50mm) |
Produkt ist nicht verfügbar |
|
![]() |
B32674Z6155K000 | Hersteller : EPCOS / TDK |
![]() |
Produkt ist nicht verfügbar |