![AR 14-HZW/TN AR 14-HZW/TN](https://mm.digikey.com/Volume0/opasdata/d220001/medias/images/958/AR14-HZW%5ET-R.jpg)
AR 14-HZW/TN Assmann WSW Components
![ASS_6290_CO.pdf](/images/adobe-acrobat.png)
Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Wire Wrap
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 2798 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
5+ | 4.24 EUR |
10+ | 3.69 EUR |
34+ | 3.53 EUR |
68+ | 3.45 EUR |
102+ | 3.3 EUR |
272+ | 2.98 EUR |
510+ | 2.75 EUR |
1020+ | 2.35 EUR |
2516+ | 2.2 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details AR 14-HZW/TN Assmann WSW Components
Description: CONN IC DIP SOCKET 14POS GOLD, Packaging: Tube, Features: Open Frame, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -40°C ~ 105°C, Number of Positions or Pins (Grid): 14 (2 x 7), Termination: Wire Wrap, Housing Material: Thermoplastic, Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote AR 14-HZW/TN
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
---|---|---|---|---|---|
AR 14-HZW/TN | Hersteller : Assmann WSW Components GMBH |
![]() |
Produkt ist nicht verfügbar |