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APTM100DSK35T3G Microchip Technology
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Technische Details APTM100DSK35T3G Microchip Technology
Description: MOSFET 2N-CH 1000V 22A SP3, Packaging: Bulk, Package / Case: SP3, Mounting Type: Chassis Mount, Configuration: 2 N-Channel (Dual), Operating Temperature: -40°C ~ 150°C (TJ), Technology: MOSFET (Metal Oxide), Power - Max: 390W, Drain to Source Voltage (Vdss): 1000V (1kV), Current - Continuous Drain (Id) @ 25°C: 22A, Input Capacitance (Ciss) (Max) @ Vds: 5200pF @ 25V, Rds On (Max) @ Id, Vgs: 420mOhm @ 11A, 10V, Gate Charge (Qg) (Max) @ Vgs: 186nC @ 10V, Vgs(th) (Max) @ Id: 5V @ 2.5mA, Supplier Device Package: SP3.
Weitere Produktangebote APTM100DSK35T3G
Foto | Bezeichnung | Hersteller | Beschreibung |
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APTM100DSK35T3G | Hersteller : MICROCHIP (MICROSEMI) |
![]() Description: Module; diode/transistor; 1kV; 17A; SP3; Press-in PCB; Idm: 88A Technology: POWER MOS 7® Semiconductor structure: diode/transistor Case: SP3 Power dissipation: 390W Electrical mounting: Press-in PCB Mechanical mounting: screw Type of module: MOSFET transistor Gate-source voltage: ±30V Topology: buck chopper x2; NTC thermistor Pulsed drain current: 88A Drain-source voltage: 1kV Drain current: 17A On-state resistance: 0.42Ω Anzahl je Verpackung: 1 Stücke |
Produkt ist nicht verfügbar |
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APTM100DSK35T3G | Hersteller : Microchip Technology |
![]() Packaging: Bulk Package / Case: SP3 Mounting Type: Chassis Mount Configuration: 2 N-Channel (Dual) Operating Temperature: -40°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) Power - Max: 390W Drain to Source Voltage (Vdss): 1000V (1kV) Current - Continuous Drain (Id) @ 25°C: 22A Input Capacitance (Ciss) (Max) @ Vds: 5200pF @ 25V Rds On (Max) @ Id, Vgs: 420mOhm @ 11A, 10V Gate Charge (Qg) (Max) @ Vgs: 186nC @ 10V Vgs(th) (Max) @ Id: 5V @ 2.5mA Supplier Device Package: SP3 |
Produkt ist nicht verfügbar |
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APTM100DSK35T3G | Hersteller : Microchip Technology |
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Produkt ist nicht verfügbar |
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APTM100DSK35T3G | Hersteller : MICROCHIP (MICROSEMI) |
![]() Description: Module; diode/transistor; 1kV; 17A; SP3; Press-in PCB; Idm: 88A Technology: POWER MOS 7® Semiconductor structure: diode/transistor Case: SP3 Power dissipation: 390W Electrical mounting: Press-in PCB Mechanical mounting: screw Type of module: MOSFET transistor Gate-source voltage: ±30V Topology: buck chopper x2; NTC thermistor Pulsed drain current: 88A Drain-source voltage: 1kV Drain current: 17A On-state resistance: 0.42Ω |
Produkt ist nicht verfügbar |