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APTGT50SK170T1G Microchip Technology
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Technische Details APTGT50SK170T1G Microchip Technology
Description: IGBT MODULE 1700V 75A 312W SP1, Packaging: Bulk, Package / Case: SP1, Mounting Type: Chassis Mount, Input: Standard, Configuration: Single, Operating Temperature: -40°C ~ 150°C (TJ), Vce(on) (Max) @ Vge, Ic: 2.4V @ 15V, 50A, NTC Thermistor: Yes, Supplier Device Package: SP1, IGBT Type: Trench Field Stop, Part Status: Active, Current - Collector (Ic) (Max): 75 A, Voltage - Collector Emitter Breakdown (Max): 1700 V, Power - Max: 312 W, Current - Collector Cutoff (Max): 250 µA, Input Capacitance (Cies) @ Vce: 4.4 nF @ 25 V.
Weitere Produktangebote APTGT50SK170T1G
Foto | Bezeichnung | Hersteller | Beschreibung |
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APTGT50SK170T1G | Hersteller : MICROCHIP (MICROSEMI) |
![]() Description: Module: IGBT; diode/transistor; buck chopper,NTC thermistor Electrical mounting: Press-in PCB Mechanical mounting: screw Application: motors Type of module: IGBT Technology: Field Stop; Trench Topology: buck chopper; NTC thermistor Case: SP1 Max. off-state voltage: 1.7kV Semiconductor structure: diode/transistor Gate-emitter voltage: ±20V Collector current: 50A Pulsed collector current: 100A Anzahl je Verpackung: 17 Stücke |
Produkt ist nicht verfügbar |
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APTGT50SK170T1G | Hersteller : MICROSEMI |
![]() Anzahl je Verpackung: 1 Stücke |
Produkt ist nicht verfügbar |
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APTGT50SK170T1G | Hersteller : Microchip Technology |
![]() Packaging: Bulk Package / Case: SP1 Mounting Type: Chassis Mount Input: Standard Configuration: Single Operating Temperature: -40°C ~ 150°C (TJ) Vce(on) (Max) @ Vge, Ic: 2.4V @ 15V, 50A NTC Thermistor: Yes Supplier Device Package: SP1 IGBT Type: Trench Field Stop Part Status: Active Current - Collector (Ic) (Max): 75 A Voltage - Collector Emitter Breakdown (Max): 1700 V Power - Max: 312 W Current - Collector Cutoff (Max): 250 µA Input Capacitance (Cies) @ Vce: 4.4 nF @ 25 V |
Produkt ist nicht verfügbar |
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APTGT50SK170T1G | Hersteller : Microchip Technology |
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Produkt ist nicht verfügbar |
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APTGT50SK170T1G | Hersteller : MICROCHIP (MICROSEMI) |
![]() Description: Module: IGBT; diode/transistor; buck chopper,NTC thermistor Electrical mounting: Press-in PCB Mechanical mounting: screw Application: motors Type of module: IGBT Technology: Field Stop; Trench Topology: buck chopper; NTC thermistor Case: SP1 Max. off-state voltage: 1.7kV Semiconductor structure: diode/transistor Gate-emitter voltage: ±20V Collector current: 50A Pulsed collector current: 100A |
Produkt ist nicht verfügbar |