APTGLQ300A120G Microchip Technology
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Technische Details APTGLQ300A120G Microchip Technology
Description: IGBT MODULE 1200V 500A 1500W SP6, Packaging: Bulk, Package / Case: Module, Mounting Type: Chassis Mount, Input: Standard, Configuration: Half Bridge, Operating Temperature: -40°C ~ 175°C (TJ), Vce(on) (Max) @ Vge, Ic: 2.42V @ 15V, 300A, NTC Thermistor: No, Supplier Device Package: SP6, IGBT Type: Trench Field Stop, Current - Collector (Ic) (Max): 500 A, Voltage - Collector Emitter Breakdown (Max): 1200 V, Power - Max: 1500 W, Current - Collector Cutoff (Max): 200 µA, Input Capacitance (Cies) @ Vce: 17.6 nF @ 25 V.
Weitere Produktangebote APTGLQ300A120G
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
|---|---|---|---|---|---|
| APTGLQ300A120G | Hersteller : MICROCHIP (MICROSEMI) |
 Category: IGBT modulesDescription: Module: IGBT; transistor/transistor; IGBT half-bridge; Ic: 300A Topology: IGBT half-bridge Technology: Field Stop; Trench Case: SP6C Application: motors Collector current: 300A Pulsed collector current: 960A Gate-emitter voltage: ±20V Semiconductor structure: transistor/transistor Max. off-state voltage: 1.2kV Electrical mounting: FASTON connectors; screw Mechanical mounting: screw Type of module: IGBT Anzahl je Verpackung: 5 Stücke |
Produkt ist nicht verfügbar |
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| APTGLQ300A120G | Hersteller : Microchip Technology |
Description: IGBT MODULE 1200V 500A 1500W SP6 Packaging: Bulk Package / Case: Module Mounting Type: Chassis Mount Input: Standard Configuration: Half Bridge Operating Temperature: -40°C ~ 175°C (TJ) Vce(on) (Max) @ Vge, Ic: 2.42V @ 15V, 300A NTC Thermistor: No Supplier Device Package: SP6 IGBT Type: Trench Field Stop Current - Collector (Ic) (Max): 500 A Voltage - Collector Emitter Breakdown (Max): 1200 V Power - Max: 1500 W Current - Collector Cutoff (Max): 200 µA Input Capacitance (Cies) @ Vce: 17.6 nF @ 25 V |
Produkt ist nicht verfügbar |
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APTGLQ300A120G | Hersteller : Microsemi |
IGBT Modules |
Produkt ist nicht verfügbar |
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| APTGLQ300A120G | Hersteller : MICROCHIP (MICROSEMI) |
Category: IGBT modules Description: Module: IGBT; transistor/transistor; IGBT half-bridge; Ic: 300A Topology: IGBT half-bridge Technology: Field Stop; Trench Case: SP6C Application: motors Collector current: 300A Pulsed collector current: 960A Gate-emitter voltage: ±20V Semiconductor structure: transistor/transistor Max. off-state voltage: 1.2kV Electrical mounting: FASTON connectors; screw Mechanical mounting: screw Type of module: IGBT |
Produkt ist nicht verfügbar |