Technische Details APT50GF60JCU2 MICROSEMI
Description: IGBT MODULE 600V 70A 277W SOT227, Packaging: Bulk, Package / Case: SOT-227-4, miniBLOC, Mounting Type: Chassis, Stud Mount, Input: Standard, Configuration: Single, Operating Temperature: -55°C ~ 150°C (TJ), Vce(on) (Max) @ Vge, Ic: 2.45V @ 15V, 50A, NTC Thermistor: No, Supplier Device Package: SOT-227, IGBT Type: NPT, Current - Collector (Ic) (Max): 70 A, Voltage - Collector Emitter Breakdown (Max): 600 V, Power - Max: 277 W, Current - Collector Cutoff (Max): 250 µA, Input Capacitance (Cies) @ Vce: 2.2 nF @ 25 V.
Weitere Produktangebote APT50GF60JCU2
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
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|---|---|---|---|---|---|
| APT50GF60JCU2 | Hersteller : Microsemi Corporation |
Description: IGBT MODULE 600V 70A 277W SOT227 Packaging: Bulk Package / Case: SOT-227-4, miniBLOC Mounting Type: Chassis, Stud Mount Input: Standard Configuration: Single Operating Temperature: -55°C ~ 150°C (TJ) Vce(on) (Max) @ Vge, Ic: 2.45V @ 15V, 50A NTC Thermistor: No Supplier Device Package: SOT-227 IGBT Type: NPT Current - Collector (Ic) (Max): 70 A Voltage - Collector Emitter Breakdown (Max): 600 V Power - Max: 277 W Current - Collector Cutoff (Max): 250 µA Input Capacitance (Cies) @ Vce: 2.2 nF @ 25 V |
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