Technische Details APM6-060-06.5-S-04-2-A-TR Samtec
Description: 0.635 MM PITCH ACCELERATE HP HIG, Packaging: Bulk, Features: Board Guide, Connector Type: High Density Array, Male, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 240, Pitch: 0.025" (0.64mm), Height Above Board: 0.328" (8.33mm), Contact Finish Thickness: 30.0µin (0.76µm), Mated Stacking Heights: 10mm, Number of Rows: 4.
Weitere Produktangebote APM6-060-06.5-S-04-2-A-TR
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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APM6-060-06.5-S-04-2-A-TR | Hersteller : Samtec |
 0.635 mm High-Performance Array System |
Produkt ist nicht verfügbar |
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| APM6-060-06.5-S-04-2-A-TR | Hersteller : Samtec Inc. |
Description: 0.635 MM PITCH ACCELERATE HP HIG Packaging: Bulk Features: Board Guide Connector Type: High Density Array, Male Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 240 Pitch: 0.025" (0.64mm) Height Above Board: 0.328" (8.33mm) Contact Finish Thickness: 30.0µin (0.76µm) Mated Stacking Heights: 10mm Number of Rows: 4 |
Produkt ist nicht verfügbar |
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APM6-060-06.5-S-04-2-A-TR | Hersteller : Samtec |
Board to Board & Mezzanine Connectors 0.635 mm Pitch AcceleRate HP High-Performance Array Terminal |
Produkt ist nicht verfügbar |