8420-21A1-RK-TP 3M Electronic Solutions Division
Hersteller: 3M Electronic Solutions Division
IC & Component Sockets 20P PLCC SOCKET SMT W/LOCATION POSTS
IC & Component Sockets 20P PLCC SOCKET SMT W/LOCATION POSTS
auf Bestellung 2194 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
2+ | 2.46 EUR |
10+ | 2.08 EUR |
100+ | 1.97 EUR |
250+ | 1.78 EUR |
500+ | 1.6 EUR |
1000+ | 1.45 EUR |
2500+ | 1.44 EUR |
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Technische Details 8420-21A1-RK-TP 3M Electronic Solutions Division
Description: CONN SOCKET PLCC 20POS TIN, Packaging: Tube, Features: Closed Frame, Mounting Type: Surface Mount, Type: PLCC, Operating Temperature: -40°C ~ 105°C, Number of Positions or Pins (Grid): 20 (4 x 5), Termination: Solder, Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 160.0µin (4.06µm), Contact Material - Mating: Copper Alloy, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 160.0µin (4.06µm), Contact Material - Post: Copper Alloy.
Weitere Produktangebote 8420-21A1-RK-TP
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
---|---|---|---|---|---|
8420-21A1-RK-TP | Hersteller : 3M |
Description: CONN SOCKET PLCC 20POS TIN Packaging: Tube Features: Closed Frame Mounting Type: Surface Mount Type: PLCC Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 20 (4 x 5) Termination: Solder Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 160.0µin (4.06µm) Contact Material - Mating: Copper Alloy Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 160.0µin (4.06µm) Contact Material - Post: Copper Alloy |
Produkt ist nicht verfügbar |