Produkte > MILL-MAX MANUFACTURING CORP. > 807-22-001-30-019101
807-22-001-30-019101

807-22-001-30-019101 Mill-Max Manufacturing Corp.


2019-08%3A019.4.pdf Hersteller: Mill-Max Manufacturing Corp.
Description: CONTACT SPRING LOADED SMD GOLD
Packaging: Bulk
Features: Pick and Place
Contact Finish: Gold
Mounting Type: Surface Mount
Contact Type: Sleeve & Plunger (Pogo Pins)
Contact Finish Thickness: 20.0µin (0.51µm)
Contact Material: Copper Alloy
Mating Cycles: 1000000
Part Status: Active
Maximum Working Height: 0.430" (10.92mm)
Recommended Working Height: 0.402" (10.22mm)
Pad Layout Dimension: Circular - 0.082" (2.08mm)
Plunger Size: 0.042" (1.07mm) Dia
Operating Force - Initial: 25gf
Operating Force - Mid Compression: 60gf
Produkt ist nicht verfügbar

Produktrezensionen
Produktbewertung abgeben

Technische Details 807-22-001-30-019101 Mill-Max Manufacturing Corp.

Description: CONTACT SPRING LOADED SMD GOLD, Packaging: Bulk, Features: Pick and Place, Contact Finish: Gold, Mounting Type: Surface Mount, Contact Type: Sleeve & Plunger (Pogo Pins), Contact Finish Thickness: 20.0µin (0.51µm), Contact Material: Copper Alloy, Mating Cycles: 1000000, Part Status: Active, Maximum Working Height: 0.430" (10.92mm), Recommended Working Height: 0.402" (10.22mm), Pad Layout Dimension: Circular - 0.082" (2.08mm), Plunger Size: 0.042" (1.07mm) Dia, Operating Force - Initial: 25gf, Operating Force - Mid Compression: 60gf.

Weitere Produktangebote 807-22-001-30-019101

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit
Preis ohne MwSt
807-22-001-30-019101 Hersteller : Mill-Max MMMC_S_A0007399072_1-2559788.pdf Circuit Board Hardware - PCB STD SPRING-LOADED CONNECTOR
Produkt ist nicht verfügbar