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807-22-001-30-015101

807-22-001-30-015101 Mill-Max


MMMC_S_A0007395514_1-2559276.pdf Hersteller: Mill-Max
Circuit Board Hardware - PCB STD SPRING-LOADED CONNECTOR
auf Bestellung 149 Stücke:

Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+6.58 EUR
10+ 5.51 EUR
100+ 5.26 EUR
250+ 4.59 EUR
500+ 4.45 EUR
1000+ 3.8 EUR
2500+ 3.54 EUR
Produktrezensionen
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Technische Details 807-22-001-30-015101 Mill-Max

Description: CONTACT SPRING LOADED SMD GOLD, Packaging: Bulk, Features: Pick and Place, Contact Finish: Gold, Mounting Type: Surface Mount, Contact Type: Sleeve & Plunger (Pogo Pins), Contact Finish Thickness: 20.0µin (0.51µm), Contact Material: Copper Alloy, Mating Cycles: 1000000, Maximum Working Height: 0.350" (8.89mm), Recommended Working Height: 0.322" (8.19mm), Pad Layout Dimension: Circular - 0.082" (2.08mm), Plunger Size: 0.042" (1.07mm) Dia, Operating Force - Initial: 25gf, Operating Force - Mid Compression: 60gf.

Weitere Produktangebote 807-22-001-30-015101 nach Preis ab 20.26 EUR bis 23.76 EUR

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit
Preis ohne MwSt
807-22-001-30-015101 807-22-001-30-015101 Hersteller : Mill-Max Manufacturing Corp. 2019-08%3A019.4.pdf Description: CONTACT SPRING LOADED SMD GOLD
Packaging: Bulk
Features: Pick and Place
Contact Finish: Gold
Mounting Type: Surface Mount
Contact Type: Sleeve & Plunger (Pogo Pins)
Contact Finish Thickness: 20.0µin (0.51µm)
Contact Material: Copper Alloy
Mating Cycles: 1000000
Maximum Working Height: 0.350" (8.89mm)
Recommended Working Height: 0.322" (8.19mm)
Pad Layout Dimension: Circular - 0.082" (2.08mm)
Plunger Size: 0.042" (1.07mm) Dia
Operating Force - Initial: 25gf
Operating Force - Mid Compression: 60gf
auf Bestellung 38 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+23.76 EUR
10+ 21.07 EUR
25+ 20.26 EUR