Produkte > MILL-MAX > 807-22-001-10-022101
807-22-001-10-022101

807-22-001-10-022101 Mill-Max


Mill-Max_03212019_807-22-001-10-020101-1545127.pdf Hersteller: Mill-Max
Circuit Board Hardware - PCB
auf Bestellung 367 Stücke:

Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+7.6 EUR
10+ 6.9 EUR
25+ 6.53 EUR
50+ 6.39 EUR
100+ 6.07 EUR
250+ 5.32 EUR
500+ 5.16 EUR
Produktrezensionen
Produktbewertung abgeben

Technische Details 807-22-001-10-022101 Mill-Max

Description: CONTACT SPRING LOADED T/H GOLD, Packaging: Bulk, Features: Pick and Place, Contact Finish: Gold, Mounting Type: Through Hole, Contact Type: Sleeve & Plunger (Pogo Pins), Contact Finish Thickness: 20.0µin (0.51µm), Contact Material: Copper Alloy, Mating Cycles: 1000000, Part Status: Active, Maximum Working Height: 0.334" (8.48mm), Recommended Working Height: 0.289" (7.34mm), Pad Layout Dimension: Circular - 0.072" (1.83mm) (TH), Plunger Size: 0.042" (1.07mm) Dia, Operating Force - Initial: 25gf, Operating Force - Mid Compression: 60gf.

Weitere Produktangebote 807-22-001-10-022101 nach Preis ab 14.33 EUR bis 16.83 EUR

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit
Preis ohne MwSt
807-22-001-10-022101 807-22-001-10-022101 Hersteller : Mill-Max Manufacturing Corp. 2019-08%3A019.6.pdf Description: CONTACT SPRING LOADED T/H GOLD
Packaging: Bulk
Features: Pick and Place
Contact Finish: Gold
Mounting Type: Through Hole
Contact Type: Sleeve & Plunger (Pogo Pins)
Contact Finish Thickness: 20.0µin (0.51µm)
Contact Material: Copper Alloy
Mating Cycles: 1000000
Part Status: Active
Maximum Working Height: 0.334" (8.48mm)
Recommended Working Height: 0.289" (7.34mm)
Pad Layout Dimension: Circular - 0.072" (1.83mm) (TH)
Plunger Size: 0.042" (1.07mm) Dia
Operating Force - Initial: 25gf
Operating Force - Mid Compression: 60gf
auf Bestellung 47 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+16.83 EUR
10+ 14.91 EUR
25+ 14.33 EUR
Mindestbestellmenge: 2