77709-332LF Amphenol Communications Solutions
Hersteller: Amphenol Communications Solutions
BergStik, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single row, Double Body, Polarization, 1 Positions, 2.54mm (0.100in) Pitch
BergStik, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single row, Double Body, Polarization, 1 Positions, 2.54mm (0.100in) Pitch
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Technische Details 77709-332LF Amphenol Communications Solutions
Description: CONN HDR STACK, Packaging: Bag, Color: Black, Mounting Type: Through Hole, Pitch: 0.100" (2.54mm), Termination: Solder, Contact Finish - Post (Mating): Gold, GXT™, Contact Finish Thickness - Post (Mating): 30.0µin (0.76µm), Number of Rows: 1, Number of Positions: 1, Length - Overall Pin: 0.496" (12.600mm), Length - Post (Mating): 0.120" (3.050mm), Length - Stack Height: 0.256" (6.500mm), Length - Tail: 0.120" (3.050mm).
Weitere Produktangebote 77709-332LF
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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77709-332LF | Hersteller : Amphenol ICC (FCI) |
Description: CONN HDR STACK Packaging: Bag Color: Black Mounting Type: Through Hole Pitch: 0.100" (2.54mm) Termination: Solder Contact Finish - Post (Mating): Gold, GXT™ Contact Finish Thickness - Post (Mating): 30.0µin (0.76µm) Number of Rows: 1 Number of Positions: 1 Length - Overall Pin: 0.496" (12.600mm) Length - Post (Mating): 0.120" (3.050mm) Length - Stack Height: 0.256" (6.500mm) Length - Tail: 0.120" (3.050mm) |
Produkt ist nicht verfügbar |
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77709-332LF | Hersteller : Amphenol FCI | Headers & Wire Housings BERGSTIK |
Produkt ist nicht verfügbar |