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71609-325LF Amphenol FCI
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Board to Board & Mezzanine Connectors 25P BtB RECPT DR SMT .76 AU HORIZONTAL
auf Bestellung 41 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
1+ | 11.99 EUR |
9+ | 10.17 EUR |
27+ | 9.93 EUR |
108+ | 9.42 EUR |
252+ | 8.43 EUR |
504+ | 7.83 EUR |
1008+ | 7.6 EUR |
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Technische Details 71609-325LF Amphenol FCI
Description: CONN RCPT 50POS 0.1 GOLD SMD R/A, Packaging: Tube, Connector Type: Receptacle, Mounting Type: Surface Mount, Right Angle, Number of Positions: 50, Style: Board to Board, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Gray, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Post: Tin, Insulation Height: 0.230" (5.85mm), Row Spacing - Mating: 0.100" (2.54mm), Number of Rows: 2.
Weitere Produktangebote 71609-325LF
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
---|---|---|---|---|---|
71609-325LF | Hersteller : Amphenol ICC (FCI) |
![]() Packaging: Tube Connector Type: Receptacle Mounting Type: Surface Mount, Right Angle Number of Positions: 50 Style: Board to Board Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Gray Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Insulation Height: 0.230" (5.85mm) Row Spacing - Mating: 0.100" (2.54mm) Number of Rows: 2 |
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