614-83-168-17-101112 Preci-Dip
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Technische Details 614-83-168-17-101112 Preci-Dip
Description: CONN SOCKET PGA 168POS GOLD, Packaging: Bulk, Features: Carrier, Open Frame, Mounting Type: Through Hole, Type: PGA, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 168 (17 x 17), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Material - Post: Brass, Part Status: Active.
Weitere Produktangebote 614-83-168-17-101112
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
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614-83-168-17-101112 | Hersteller : Preci-Dip |
Description: CONN SOCKET PGA 168POS GOLD Packaging: Bulk Features: Carrier, Open Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 168 (17 x 17) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
Produkt ist nicht verfügbar |
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614-83-168-17-101112 | Hersteller : Preci-dip | IC & Component Sockets |
Produkt ist nicht verfügbar |