Technische Details 550-10-504M29-001152 Preci-Dip
Description: BGA SOLDER TAIL, Packaging: Bulk, Features: Closed Frame, Mounting Type: Through Hole, Type: BGA, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 504 (29 x 29), Termination: Solder, Housing Material: FR4 Epoxy Glass, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Brass, Pitch - Post: 0.050" (1.27mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Brass.
Weitere Produktangebote 550-10-504M29-001152
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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550-10-504M29-001152 | Hersteller : Preci-Dip |
Description: BGA SOLDER TAIL Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: BGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 504 (29 x 29) Termination: Solder Housing Material: FR4 Epoxy Glass Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Brass Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
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550-10-504M29-001152 | Hersteller : Preci-dip | IC & Component Sockets |
Produkt ist nicht verfügbar |