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530402B00150G

530402B00150G Boyd Laconia, LLC


Board-Level-Heatsinks_Cat.pdf Hersteller: Boyd Laconia, LLC
Description: HEAT SINK 1.75" HIGH RISE TO-220
Packaging: Bulk
Material: Aluminum
Length: 1.750" (44.45mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 0.750" (19.05mm)
Package Cooled: TO-220
Attachment Method: Clip and Board Mounts
Power Dissipation @ Temperature Rise: 4.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 400 LFM
Thermal Resistance @ Natural: 6.30°C/W
Fin Height: 1.750" (44.45mm)
Material Finish: Black Anodized
auf Bestellung 5743 Stücke:

Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+11.39 EUR
10+ 11.08 EUR
25+ 10.46 EUR
50+ 9.85 EUR
100+ 9.23 EUR
250+ 8.62 EUR
500+ 8 EUR
1000+ 7.85 EUR
Mindestbestellmenge: 2
Produktrezensionen
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Technische Details 530402B00150G Boyd Laconia, LLC

Description: HEAT SINK 1.75" HIGH RISE TO-220, Packaging: Bulk, Material: Aluminum, Length: 1.750" (44.45mm), Shape: Rectangular, Fins, Type: Board Level, Vertical, Width: 0.750" (19.05mm), Package Cooled: TO-220, Attachment Method: Clip and Board Mounts, Power Dissipation @ Temperature Rise: 4.0W @ 30°C, Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 400 LFM, Thermal Resistance @ Natural: 6.30°C/W, Fin Height: 1.750" (44.45mm), Material Finish: Black Anodized.

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