Suchergebnisse für "529367" : 6
Art der Ansicht :
Mindestbestellmenge: 17
| Foto | Bezeichnung | Hersteller | Beschreibung |
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DB101-BP | Micro Commercial Co |
Description: BRIDGE RECT 1PHASE 50V 1A DB-1 Packaging: Tube Package / Case: 4-EDIP (0.321", 8.15mm) Mounting Type: Through Hole Diode Type: Single Phase Operating Temperature: -55°C ~ 150°C (TJ) Technology: Standard Supplier Device Package: DB-1 Voltage - Peak Reverse (Max): 50 V Current - Average Rectified (Io): 1 A Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 1 A Current - Reverse Leakage @ Vr: 10 µA @ 50 V |
auf Bestellung 7171 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC1820FET100,551 | NXP USA Inc. |
 Description: IC MCU 32BIT ROMLESS 100TFBGAPackaging: Tray Package / Case: 100-TFBGA Mounting Type: Surface Mount Speed: 150MHz RAM Size: 168K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM® Cortex®-M3 Data Converters: A/D 12x10b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 100-TFBGA (9x9) Part Status: Active Number of I/O: 64 DigiKey Programmable: Not Verified |
auf Bestellung 135 Stücke: Lieferzeit 10-14 Tag (e) |
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| 14529367 | Eaton | Power Outlet Strips G3HD-MA HW D48A 15C13 9C13+3C19 |
Produkt ist nicht verfügbar |
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LPC1810FET100,551 | NXP Semiconductors |
ARM Microcontrollers - MCU 32B ARM CORTEXM3 MCU 200KB SRAM HI-SP US |
Produkt ist nicht verfügbar |
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LPC1810FET100,551 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 100TFBGA Packaging: Tray Package / Case: 100-TFBGA Mounting Type: Surface Mount Speed: 150MHz RAM Size: 136K x 8 Operating Temperature: -40°C ~ 85°C Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM® Cortex®-M3 Data Converters: A/D 12x10b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 100-TFBGA (9x9) Number of I/O: 64 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LPC1820FET100,551 | NXP Semiconductors |
ARM Microcontrollers - MCU 32B ARM CORTEXM3 MCU 200KB SRAM HI-SP US |
Produkt ist nicht verfügbar |
| DB101-BP |
Hersteller: Micro Commercial Co
Description: BRIDGE RECT 1PHASE 50V 1A DB-1
Packaging: Tube
Package / Case: 4-EDIP (0.321", 8.15mm)
Mounting Type: Through Hole
Diode Type: Single Phase
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: Standard
Supplier Device Package: DB-1
Voltage - Peak Reverse (Max): 50 V
Current - Average Rectified (Io): 1 A
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 1 A
Current - Reverse Leakage @ Vr: 10 µA @ 50 V
Description: BRIDGE RECT 1PHASE 50V 1A DB-1
Packaging: Tube
Package / Case: 4-EDIP (0.321", 8.15mm)
Mounting Type: Through Hole
Diode Type: Single Phase
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: Standard
Supplier Device Package: DB-1
Voltage - Peak Reverse (Max): 50 V
Current - Average Rectified (Io): 1 A
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 1 A
Current - Reverse Leakage @ Vr: 10 µA @ 50 V
auf Bestellung 7171 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 17+ | 1.06 EUR |
| 50+ | 0.54 EUR |
| 100+ | 0.48 EUR |
| 500+ | 0.38 EUR |
| 1000+ | 0.35 EUR |
| 2000+ | 0.32 EUR |
| 5000+ | 0.29 EUR |
| LPC1820FET100,551 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 150MHz
RAM Size: 168K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 12x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 150MHz
RAM Size: 168K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 12x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 135 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 19.18 EUR |
| 10+ | 13.49 EUR |
| 25+ | 12.02 EUR |
| 80+ | 10.6 EUR |
| 14529367 |
Hersteller: Eaton
Power Outlet Strips G3HD-MA HW D48A 15C13 9C13+3C19
Power Outlet Strips G3HD-MA HW D48A 15C13 9C13+3C19
Produkt ist nicht verfügbar
| LPC1810FET100,551 |
|
Hersteller: NXP Semiconductors
ARM Microcontrollers - MCU 32B ARM CORTEXM3 MCU 200KB SRAM HI-SP US
ARM Microcontrollers - MCU 32B ARM CORTEXM3 MCU 200KB SRAM HI-SP US
Produkt ist nicht verfügbar
| LPC1810FET100,551 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 150MHz
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 12x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 150MHz
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 12x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 64
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| LPC1820FET100,551 |
|
Hersteller: NXP Semiconductors
ARM Microcontrollers - MCU 32B ARM CORTEXM3 MCU 200KB SRAM HI-SP US
ARM Microcontrollers - MCU 32B ARM CORTEXM3 MCU 200KB SRAM HI-SP US
Produkt ist nicht verfügbar