Technische Details 528-AG12D-ES-LF TE Connectivity
Description: CONN IC DIP SOCKET 28POS TIN, Packaging: Tube, Features: Closed Frame, Mounting Type: Through Hole, Type: DIP, 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 28 (2 x 14), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Material - Post: Nickel.
Weitere Produktangebote 528-AG12D-ES-LF
Foto | Bezeichnung | Hersteller | Beschreibung |
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528-AG12D-ES-LF | Hersteller : TE Connectivity AMP Connectors |
![]() Packaging: Tube Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Nickel |
Produkt ist nicht verfügbar |
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528-AG12D-ES-LF | Hersteller : TE Connectivity |
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Produkt ist nicht verfügbar |