511-13-155-16-003001 Mill-Max Mfg. Corp.
Produkt ist nicht verfügbar
Produktrezensionen
Produktbewertung abgeben
Technische Details 511-13-155-16-003001 Mill-Max Mfg. Corp.
Description: SKT PGA SOLDRTL, Features: Open Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: PGA, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 155 (16 x 16), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Brass Alloy.
Weitere Produktangebote 511-13-155-16-003001
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
---|---|---|---|---|---|
511-13-155-16-003001 | Hersteller : Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 155 (16 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy |
Produkt ist nicht verfügbar |
||
511-13-155-16-003001 | Hersteller : Mill-Max | Circuit Board Hardware - PCB STANDRD SOLDER TAIL PGA SOCKET |
Produkt ist nicht verfügbar |