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505568-0470

505568-0470 Molex


5055680470_PCB_HEADERS.pdf Hersteller: Molex
Description: 1.25WB SINGLE ST ASSY 4CKT EMBPK
Packaging: Box
Features: Pick and Place, Solder Retention
Connector Type: Header
Voltage Rating: 50VAC/DC
Current Rating (Amps): Varies by Wire Gauge
Mounting Type: Surface Mount
Number of Positions: 4
Number of Rows: 1
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Brass
Insulation Color: Natural
Pitch - Mating: 0.049" (1.25mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.165" (4.20mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Polyamide (PA), Nylon, Glass Filled
auf Bestellung 14400 Stücke:

Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1200+0.72 EUR
3600+ 0.69 EUR
6000+ 0.65 EUR
10800+ 0.63 EUR
Mindestbestellmenge: 1200
Produktrezensionen
Produktbewertung abgeben

Technische Details 505568-0470 Molex

Description: 1.25WB SINGLE ST ASSY 4CKT EMBPK, Features: Pick and Place, Solder Retention, Packaging: Bulk, Connector Type: Header, Voltage Rating: 50VAC/DC, Current Rating (Amps): Varies by Wire Gauge, Mounting Type: Surface Mount, Number of Positions: 4, Number of Rows: 1, Style: Board to Cable/Wire, Operating Temperature: -40°C ~ 105°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Brass, Insulation Color: Natural, Pitch - Mating: 0.049" (1.25mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 39.4µin (1.00µm), Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Insulation Height: 0.165" (4.20mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Polyamide (PA), Nylon, Glass Filled.

Weitere Produktangebote 505568-0470

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit
Preis ohne MwSt
505568-0470 Hersteller : MOLEX / PARTNER STOCK MOLE-S-A0010995069-1.pdf?hkey=6D3A4C79FDBF58556ACFDE234799DDF0 Description: MOLEX / PARTNER STOCK - 505568-0470 - Stiftleiste, Signal, Wire-to-Board, 1.25 mm, 1 Reihe(n), 4 Kontakt(e), Oberflächenmontage, gerade
tariffCode: 85366930
rohsCompliant: YES
Kontaktüberzug: Kontakte beschichtet mit Zinn-Wismut
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Messing
usEccn: EAR99
Steckverbinderkragen: Mit Kragen
Anzahl der Kontakte: 4Contacts
euEccn: NLR
Steckverbindersysteme: Signal, Wire-to-Board
Produktpalette: Micro-Lock Plus 505568 Series
productTraceability: No
Kontaktanschluss: Oberflachenmontage, gerade
Anzahl der Reihen: 1Reihe(n)
Rastermaß: 1.25mm
SVHC: No SVHC (14-Jun-2023)
auf Bestellung 7200 Stücke:
Lieferzeit 14-21 Tag (e)
505568-0470 Hersteller : MOLEX 5055680470_PCB_HEADERS.pdf 5055680470-MOL Signal connectors - Unclassified
Produkt ist nicht verfügbar
5055680470 Hersteller : Molex 5055680470_sd.pdf Description: 1.25WB SINGLE ST ASSY 4CKT EMBPK
Features: Pick and Place, Solder Retention
Packaging: Bulk
Connector Type: Header
Voltage Rating: 50VAC/DC
Current Rating (Amps): Varies by Wire Gauge
Mounting Type: Surface Mount
Number of Positions: 4
Number of Rows: 1
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Brass
Insulation Color: Natural
Pitch - Mating: 0.049" (1.25mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.165" (4.20mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Polyamide (PA), Nylon, Glass Filled
Produkt ist nicht verfügbar