Produkte > MOLEX > 5023521001

5023521001 Molex


5023521001_sd.pdf Hersteller: Molex
5023521001
Produkt ist nicht verfügbar

Produktrezensionen
Produktbewertung abgeben

Technische Details 5023521001 Molex

Description: 2.0 W/B CONN SN 10CKT EMBS TP PI, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Header, Voltage Rating: 125VAC/DC, Current Rating (Amps): Varies by Wire Gauge, Mounting Type: Surface Mount, Right Angle, Number of Positions: 10, Number of Rows: 1, Style: Board to Cable/Wire, Operating Temperature: -40°C ~ 105°C, Contact Type: Male Pin, Fastening Type: Latch Holder, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Copper Alloy, Insulation Color: Black, Pitch - Mating: 0.079" (2.00mm), Contact Finish - Mating: Tin, Contact Finish - Post: Tin, Contact Shape: Square, Insulation Height: 0.252" (6.40mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Polyamide (PA), Nylon.

Weitere Produktangebote 5023521001

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit
Preis ohne MwSt
5023521001 Hersteller : Molex 5023521001_sd.pdf Description: 2.0 W/B CONN SN 10CKT EMBS TP PI
Features: Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Header
Voltage Rating: 125VAC/DC
Current Rating (Amps): Varies by Wire Gauge
Mounting Type: Surface Mount, Right Angle
Number of Positions: 10
Number of Rows: 1
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Latch Holder
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Copper Alloy
Insulation Color: Black
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Tin
Contact Finish - Post: Tin
Contact Shape: Square
Insulation Height: 0.252" (6.40mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Polyamide (PA), Nylon
Produkt ist nicht verfügbar