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48-6570-10

48-6570-10 Aries Electronics

10019-universal-zif-test-and-burn-in-socket-336489.pdf Hersteller: Aries Electronics
IC & Component Sockets QUICK RELEASE 48 PIN TIN
auf Bestellung 7 Stücke:
Lieferzeit 73-77 Tag (e)
Anzahl Preis ohne MwSt
1+39.07 EUR
7+ 34.27 EUR
252+ 33.93 EUR
504+ 33.69 EUR
1001+ 33.49 EUR
2506+ 33.23 EUR
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Technische Details 48-6570-10 Aries Electronics

Description: CONN IC DIP SOCKET ZIF 48POS TIN, Packaging: Bulk, Features: Closed Frame, Mounting Type: Through Hole, Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 48 (2 x 24), Termination: Solder, Housing Material: Polyphenylene Sulfide (PPS), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Beryllium Copper, Part Status: Active.

Weitere Produktangebote 48-6570-10

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48-6570-10 Hersteller : Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 48POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
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