44-547-11 Aries Electronics
Hersteller: Aries ElectronicsDescription: CONN SOCKET SOIC ZIF 44POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SOIC, ZIF (ZIP)
Number of Positions or Pins (Grid): 44 (2 x 22)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 20.0µin (0.51µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 20.0µin (0.51µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 386.07 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 44-547-11 Aries Electronics
Description: CONN SOCKET SOIC ZIF 44POS GOLD, Features: Closed Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: SOIC, ZIF (ZIP), Number of Positions or Pins (Grid): 44 (2 x 22), Termination: Solder, Housing Material: Polyphenylene Sulfide (PPS), Glass Filled, Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 20.0µin (0.51µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.050" (1.27mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 20.0µin (0.51µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote 44-547-11
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
 |
44-547-11 | Hersteller : Aries Electronics |
IC & Component Sockets UNIV SOIC ZIF SKT |
Produkt ist nicht verfügbar |