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4309R-101-220LF Bourns Inc.
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Description: RNET - THK FILM MOLD SIP
Resistance (Ohms): 22
Tolerance: ±2%
Packaging: Tube
Power Per Element: 750mW
Circuit Type: Bussed
Number of Pins: 9
Package / Case: 9-SIP
Temperature Coefficient: ±250ppm/°C
Size / Dimension: 0.884" L x 0.085" W (22.45mm x 2.16mm)
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 125°C
Supplier Device Package: 9-SIP
Height - Seated (Max): 0.195" (4.95mm)
Resistor-Ratio-Drift: 50ppm/°C
Number of Resistors: 8
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Technische Details 4309R-101-220LF Bourns Inc.
Description: RNET - THK FILM MOLD SIP, Resistance (Ohms): 22, Tolerance: ±2%, Packaging: Tube, Power Per Element: 750mW, Circuit Type: Bussed, Number of Pins: 9, Package / Case: 9-SIP, Temperature Coefficient: ±250ppm/°C, Size / Dimension: 0.884" L x 0.085" W (22.45mm x 2.16mm), Mounting Type: Through Hole, Operating Temperature: -55°C ~ 125°C, Supplier Device Package: 9-SIP, Height - Seated (Max): 0.195" (4.95mm), Resistor-Ratio-Drift: 50ppm/°C, Number of Resistors: 8.
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4309R-101-220LF | Hersteller : Bourns |
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